Koch Chemie Micro Cut Pad
Micro-Cut Pad High-quality special sponge for removing fine scratches, holograms, and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23mm creates low torsion forces, very good handling, and the highest level of stability.
The special density of the foam material enables long-lasting compression hardness during polishing. The optimized reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.
The colorful non-woven material, suitable for polishing, ensures process safety.
Compression hardness: 10
Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.